Latest Headlines

31. LG Electronics Unveils Next-Generation Smart Telematics Solution At MWC Barcelona 2026 2/24/2026

    LG Electronics (LG) will unveil its next-generation smart telematics solution at Mobile World Congress (MWC) Barcelona 2026, the world's largest and most influential connectivity event, taking place in Barcelona, Spain, from March 2-5.

32. Bridgestone To Broaden Segment Coverage With The Launch Of Three New Tires At CONEXPO-CONAGG 2/24/2026

    Bridgestone Americas (Bridgestone) will debut three new off-the-road tires at CONEXPO-CONAGG: the 27.00R49 Bridgestone MasterCore V-Steel M-Traction Deep (VMTD), the 24.00R35 Bridgestone V-Steel Rock Deep Ultra (VRDU), and the Firestone Multi Block T.

33. Panasonic Automotive Systems Secures Industry-Wide Endorsement For Its Initiative To Standardize VirtIO Device Virtualization Technology 2/23/2026

    Panasonic Automotive Systems Co., Ltd. ⁠(Headquarters: Yokohama, Kanagawa, Japan; President: Masashi Nagayasu) has been actively promoting the global adoption and industry-wide standardization of VirtIO—an open-source device virtualization technology advanced by industry groups such as AGL^*1, Android™, OASIS^*2, and SOAFEE^*3—for automotive applications.

34. Garrett Motion's E-Cooling Compressor Is Redefining Thermal Management Efficiency & Power For Electric Buses And Trucks In China 2/20/2026

    Garrett Motion Inc. (Nasdaq: GTX), a global leader in differentiated turbocharging and electrification technologies for automotive and industrial applications, announced the first serial award for its breakthrough oil-free, foil bearing-based centrifugal compressor in the mobility sector by Chinese industry leader Cling for electric buses and trucks in China.

35. Nexus Nova Unveils Hovercar Platform That Redefines The Road To Flight 2/4/2026

    Nexus Nova Innovations (NNI) today unveiled its hydrogen-powered hovercar platform and the Flying Fox Pilot autonomous flight network, marking a decisive step toward a new mobility category that begins on the ground and scales directly toward autonomous flight.

36. LEPAS Definiert Elegantes Fahren Mit Seiner Intelligenten LEX-Plattform 1/24/2026

    LEPAS, the brand-new new energy vehicle (NEV) brand, is designed for global markets and built on the strategic, intelligent LEX platform.

37. ATOTO CB7 Pro 301% Funded--Head Unit AI Console For Wireless Carplay/Android Auto And Camera Smart Driving 1/23/2026

    ATOTO shared an update on CB7 Pro, its Head-Unit AI Console. It's built on a simple philosophy: don't replace the factory screen give it new capabilities. CB7 Pro plugs into the USB port used for wired CarPlay or wired Android Auto, upgrades the head unit to wireless CarPlay and wireless Android Auto, adds a switchable Android 13 system, and expands the factory display into a more capable in‑car console with video, AI assistance, vehicle data integration, and entertainment options.

38. Rockwell Automation To Power Lucid's EV Manufacturing Facility In Saudi Arabia With Advanced Software Solutions 1/21/2026

    Rockwell Automation, Inc. (NYSE:ROK), the world's largest company dedicated to industrial automation and digital transformation, today announced a deepened collaboration with Lucid, maker of the world's most advanced electric vehicles, to support the automaker's expanding manufacturing facility in the Kingdom of Saudi Arabia.

39. Altia Launches Major Evolution In Automotive HMI Development With Altia Design 13.5 1/15/2026

    Altia, a global leader in model-based HMI development solutions for production embedded systems, today announced a major evolution of its platform—delivering new levels of visual realism, architectural flexibility and development efficiency for next-generation automotive cockpits with Altia Design 13.5.

40. SST And UMC Announce Immediate Availability Of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform 1/15/2026

    As the automotive industry requirements for increasingly performant vehicle controllers relentlessly drives ahead, Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc., (Nasdaq: MCHP) and United Microelectronics Corporation (NYSE: UMC: TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced today that they have completed full qualification and release to production of SST’s embedded SuperFlash® Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC’s 28HPC+ foundry process platform.