Latest Headlines
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SST And UMC Announce Immediate Availability Of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform
1/15/2026
As the automotive industry requirements for increasingly performant vehicle controllers relentlessly drives ahead, Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc., (Nasdaq: MCHP) and United Microelectronics Corporation (NYSE: UMC: TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced today that they have completed full qualification and release to production of SST’s embedded SuperFlash® Gen 4 (ESF4) with full automotive grade 1 (AG1) capability on UMC’s 28HPC+ foundry process platform.
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HARMAN Leads The Shift To Personalized, Software-Driven Audio And Sound Experiences Inside The Vehicle
1/13/2026
Audio is one of the most personal and emotionally powerful elements of the in-vehicle experience. Today, HARMAN, the automotive technology leader and subsidiary of Samsung Electronics Co., Ltd.,
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ECD Automotive Design Continues ECD x Chelsea Truck Company Defenders Following Strategic Alliance
1/9/2026
ECD Automotive Design, the world’s largest Land Rover and Jaguar restoration company known for its bespoke Defenders, Range Rovers, Jaguar E-Types, Ford Mustangs, Toyota FJs, and the ECDXCTC INEOS Grenadier and Defender II, proudly announces the continuation of the ECD x Chelsea Truck Company (CTC) Defenders with the ECDxCTC Defender 02, marking a major milestone since the official alliance between the two brands was announced in November.
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TI Accelerates The Shift Toward Autonomous Vehicles With Expanded Automotive Portfolio
1/5/2026
Texas Instruments (TI) (Nasdaq: TXN) today introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models.
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Teledyne FLIR OEM Debuts Tura Automotive-Qualified Thermal Camera At CES For AVs And ADAS
1/5/2026
Teledyne FLIR OEM, a Teledyne Technologies Incorporated company, today announced the launch of Tura, the first Automotive Safety Integrity Level (ASIL-B) thermal longwave infrared (LWIR) camera developed in compliance with ISO 26262 functional safety (FuSa) standards.
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Aptiv Powers Intelligent Edge Applications From Automotive To Robotics At CES 2026
1/5/2026
Aptiv PLC, a global industrial technology company, will showcase at CES 2026 how its intelligent edge solutions enable devices to sense, think, and act in real time—while continuously optimizing performance throughout their lifecycle.
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Ultrasense Systems Surpasses 3 Million Automotive Shipments Of Its AEC-Q100 HMI Controller, Accelerating Adoption Of The Ultrasound Intelligent Platform
1/5/2026
UltraSense Systems, the leader in solid-state human-machine interfaces powered by ultrasound, today announced a major corporate milestone: over 3 million units shipped of its AEC-Q100-qualified UltraSense HMI Controller into global automotive programs.
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Quectel Announces Industry First 5G-Advanced 3GPP R18 Automotive-Grade Cellular Module, Delivering Unmatched Performance And Reliability
1/2/2026
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of the world's first 5G-advanced (5G-A) automotive-grade cellular module, the AR588MA, establishing it as the industry's highest-performing and most reliable wireless communication product for vehicles.
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HARMAN To Acquire ZF's ADAS Business
12/23/2025
HARMAN International, a global leader in automotive technology and lifestyle audio, and a wholly-owned subsidiary of Samsung Electronics Co., Ltd., today announced that it has entered into a definitive agreement to acquire the Advanced Driver Assistance Systems (ADAS) business of ZF Group, comprising leading automotive compute solutions, smart cameras, radars and ADAS software functions.
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Siemens' New PAVE360 Automotive Drives Next-Generation Vehicle Development With Real-World Validation
12/18/2025
Today, Siemens, a leading industrial technology company, unveiled its PAVE360™ Automotive technology, a new category of digital twin software that is pre-integrated and designed as an off-the-shelf offering to address the escalating complexity of automotive hardware and software integration.