MSA-400 Micro System Analyzer

Click Here To Download:
•Brochure: MSA-400 Micro System Analyzer
•Brochure: MEMS Workstations: Micro-Motion Analysis, Assemble, Test and Repair

NEW: MSA-400 Topography Option

The MSA-400 combines scanning laser Doppler vibrometry to measure out-of-plane vibrations orthogonal to the component's surface with stroboscopic video microscopy to capture in-plane displacement parallel to the component's surface. Taken together, these techniques allow fast and complete dynamic characterization of microstructures.

In addition, static 3-D topography measurements can now be made using white light interferometry to determine structure heights and shape on both rough and specular surfaces. This is also an optical, non-contact measurement procedure, free from any impact, feedback or surface preparation to the sample.

Thus the MSA-400 Micro System Analyzer is an ideal combination of dynamic and static measurement technology for determining the essential MEMS parameters - profile, shape, critical dimensions, roughness as well as resonance frequencies, deflection shapes, damping, settling response and decay time.

• All-in-one instrument for measuring both dynamics and static topography of MEMS
  
• Rapid, non-contact measurement procedure
  
• Sub-nanometer resolution
  
• Rough and specular surface compatibility
  
• Powerful TMS software for topography and surface characterization

MSA-400 Benefits

• Increased productivity through short measurement cycle
  
• Very fast identification and visualization of all OOP and IP system resonances
  
• Integrated microscope optics with optimized optical path for best lateral resolution and highest image quality
  
• Simple and intuitive operation, measurement ready within minutes
  
• Easy integration in MEMS probe stations

MSA-400 Features

• Measures in-plane (IP) and out-of-plane (OOP) motions of micro structures
  
• Displays frequency and time domain data
  
• On-line live-video monitoring of the measurement processes, no distracting fringes in the video image
  
• Measurement probe uses sub micron laser spot (e.g. 0.7 µm FWHM for 50X lens)
  
• Scripting control for automation
  
• Out-of-plane motion:
  
  - FFT spectrum within milliseconds
  - 0 Hz to 1 MHz, standard
  - 0 Hz to 2 MHz, optional
  - 0 Hz to 20 MHz, optional
  - Analysis of transient processes
  - Picometer resolution
  - Resolution magnification independent
  
• In-plane motion:
  
  - 0.001 Hz to 2 MHz
  - Various analysis modes like Bode plots and displacement-over-time plots
  Standard export formats for measurement data, graphics and animations

MSA-400 Technology
The MSA-400 integrates Laser-Doppler Vibrometry (LDV) for the fast broadband out-ofplane (OOP) vibrational characterization and Stroboscopic Video Microscopy for the in-plane (IP) examination of MEMS devices in one compact, robust and reliable all-in-one measurement head.

The combination of these two complementary measurement techniques for investigating the vibrational behavior of small structures provides superior performance compared to singletechnology solutions like ESPI, white light interferometry or phase shifting interferometry.
The quick measurement cycle for identifying, measuring and visualizing system resonances and for measuring transient processes allows a greatly enhanced productivity in comparison to those alternative approaches. This is especially important when integrating the measurement system into automated processes as in MEMS production environments.
The highly sensitive Laser-Doppler technique is used to find all mechanical resonances rapidly without a-priori information about the device using wide-band excitation (a pure machine vision system can only measure at user-defined, discrete frequency points with single-frequency excitation). In a second step the stroboscopic video microscopy technique is used to obtain accurate amplitude and phase information of the resonances found with the Vibrometer technique.

MSA-400 Applications

Vibration and general out-of-plane and inplane motion measurement of MEMS
Continuous frequency domain measurements for device performance analysis
Microstructure failure analysis and reliability testing
Measurements of transient behavior using time mode
Identification of in-plane resonances through out-of-plane coupling
Ring down measurements to determine actuator settling times
Wafer-level MEMS motion testing using probe station
Measurement of Bode plots

Click Here To Download:
•Brochure: MSA-400 Micro System Analyzer
•Brochure: MEMS Workstations: Micro-Motion Analysis, Assemble, Test and Repair